Awards

• Leading Lawyer: TMT (Legal Times, 2023-2025)
• Award of the President and CEO of Device Solutions Division: Top Excellence Award in Semiconductor Equipment Localization (Samsung Electronics, 2005)
• Award of the President and Head of Memory Business: Development of Top Electrode Engineering for DRAM TIT Capacitors (Samsung Electronics, 2005)
• Award of the President and Head of Semiconductor R&D Center: Development of Via Plug Formation Technology for DRAM (Samsung Electronics, 2002)

Publications/Activities

• “A Proposal for a Business Model for Patent Management in Korea to Overcome Patent Troll Problems, ” Management and Law, Vol. 4 (Co-author, Sogang University Institute for Legal Studies, 2010.12.)
• “The Improved CVD-Al Metallization for Deep Small Contact Filling Using Selective Wetting Process, ” IITC (International Interconnect Technology Conference) (2003)
• “Plasma Induced Damage on Sub-50 Gate Oxide by PE-CVD Ti, ” PPID (Plasma and Process Induced Damage) (Co-author, 2003)
• “Investigation of the Contact Resistance between Ti/TiN and Ru in M1/Plate Contacts of RIS (Ruthenium Insulator Silicon) Capacitor,” JJAP (Japanese Journal of Applied Physics) (Co-author, 2003)
• “Synthesis of Polyimides Containing Triazole to Improve Their Adhesion to Copper Substrate,” Journal of Adhesion Science and Technology, Vol. 16, 1839-1851 (2002)
• “Investigation of the Contact Resistance Between Ti/TiN and Ru in M1/Plate Contacts of RIS (Ruthenium Insulator Silicon) Capacitor,” SSDM (Solid State Device Materials) (Co-author, 2002)
• “Enhancement of Contact Filling Characteristics in CVD-Al Metallization with Plasma-Treated MOCVD-TiN Wetting Layer,” AMC (Advanced Metallization Conference) (2002)
 
• Inventions: 34 domestic patents granted; 32 overseas patent applications (as of 2009)